Using micro RFD chips to verify the authenticity of electronic components

As part of a four-year project for the U.S. Defense Advanced Research Projects Agency (DARPA), the company is developing a miniature RFID chip to prevent counterfeiting of electronic parts on circuit boards on avionics or other equipment. The consulting engineer explained that the purpose of the project was to develop a near-field HF RFID product. The chip size is 100 microns * 100 microns, contains an on-board antenna and temperature sensor, and can be embedded in an integrated circuit or circuit board. The entire system—including chips, RFID Readers and specialized software—was developed to support supply chain hardware integrity for the company's Electronic Defense (SHIELD) program and combat counterfeit electronic parts sold to the U.S. government or commercial companies.

The size of the chip is similar to the Lincoln portrait on the reverse of the 1-cent Lincoln coin. In fact, a 300 mm diameter wafer can be cut into 3.5 million chips.

When the project is completed in 2019, it is expected that the chip will be used to verify the authenticity of small electronic devices, including integrated circuits used in defense and industrial fields.

"It's a big problem," Suko said. Old electronic parts can pass off as new, which threatens the effectiveness of the device. The U.S. Department of Defense (DOD) has taken steps to develop new technologies to prevent counterfeit parts within the U.S. supply chain. DOD views this as a priority.

With the help of RFID solution companies, a solution is being developed to identify and determine the authenticity of electronic components. The tiny die has an encrypted ID number and a sensor that can confirm product authenticity. RFID will also develop applications for electronic parts authentication based on the software platform.

The lab is also developing a thin-film temperature sensor that can detect temperatures above 220 degrees Celsius, which is the threshold for the manufacturing or remanufacturing process of electronic parts. When an RFID reader reads the RFID chip, such high temperatures will cause the sensor resistance to change. When a reader detects this change, it may indicate that the temperature has reached manufacturing levels (multiple times), thus providing a warning that the electronic part may be counterfeit or use an older part.

The chip will be placed at the marked location of the part that needs to be tracked. The business would then use an inexpensive near-field RFID reader to power the chip and exchange updates on the chip ID, proof of authentication, and passive environmental sensor readings.

A technology company in Seattle, Washington, is developing a probe-shaped near-field HF reader to read the chip's ID number and sensor data. The company will provide low-power, one-time programmable memory. Georgia Tech's Packaging Research Center will develop methods for cutting and processing the microchips.

The RFID tag can be read at any point in the supply chain to confirm the authenticity of the part. Subsystem and system manufacturers are expected to read these tags to confirm the authenticity of the part before manufacturing or delivering it to the product manufacturer.

If the chip is removed from the part it will no longer be usable.

Said: "The initial goal of this product is to be used in military products and civilian industries. The ultimate vision is to widely use SHIELD technology in the global integrated electronics industry."

The Department of Defense has mandated that all defense contractors provide supply chain traceability, and these requirements will make defense contractors among the first customers to adopt the system. Commercial products will also use the technology, it said. Chips will be used not only in ICs, but also in other circuit boards and components. DARPA's target price is 1 cent per chip.

The development project is divided into three phases. During the first 18-month phase, RFID technology will be developed and demonstrated at a basic level. Key functions of test chips and near-field readers will be developed and RFID software will be launched.

In the second phase, all functions of the chip will be completed and 1,000 RFID chip products will be provided.

In the third and final stage, RFID chips will be used in IC and other products of different original equipment manufacturers (OEMs). Suko explained: “This phase will evaluate the effectiveness of the SHIELD system in authenticating the authenticity of electronic parts.” Large-scale production and deployment will start in 2019.