RFID Internet of Things Application Scenarios Technological Innovation

Demand for RFID technology continues to grow in key sectors such as fast-moving consumer goods (FMCG) retail, footwear and apparel, and logistics and parcel delivery. He also pointed out that large-scale RFID deployment in the FMCG and retail industries faces challenges such as degraded RFID tag radio frequency performance in complex media environments, missed reads and cross-reading in metal and liquid environments, and insufficient chip and tag technology penetration. RFID electronic tag chips offer advantages such as high sensitivity, high reliability, excellent consistency, good stability, and low overall cost. Combined with innovative solutions (optimized antenna design, enhanced reader/writer performance and algorithms, and improved equipment scheduling efficiency), they achieve high recognition rates and yields in multiple fields. He also demonstrated the application of these chips in the food industry and catering supply chain, demonstrating improvements in item recognition accuracy to 99.8% in complex retail scenarios, real-time visibility into logistics status, and improved inventory efficiency. Finally, he mentioned that Yuzhen 611 will continue to expand its market scale and expand its application scenarios, and announced the upcoming release of a new generation of universal RFID tag chips.

Against the backdrop of the accelerated evolution of universal large-scale models, the industrial sector is driving the deep integration of AI and physical manufacturing. The 2025 "AI + Manufacturing" initiative explicitly supports the application of large-scale models in key scenarios, with the gradual development of smart factories and digital transformation progressing simultaneously. However, industrial intelligence relies on the acquisition of continuous and accurate data from the physical world, which currently faces numerous challenges. Quanray Electronics is focusing on innovation in passive IoT technology, integrating RFID, Bluetooth, and 5G-A technologies. This approach promises to enable low-cost, large-scale collection of critical data, facilitating industrial intelligent upgrades and full-lifecycle Asset MANAGEMENT. This solution effectively overcomes the bottlenecks of traditional sensor wiring, such as complex, high-cost, and difficult maintenance, providing a low-cost, scalable data engine for large industrial models and facilitating the implementation of intelligent manufacturing.

Ubiquitous connectivity promises unprecedented insights and efficiency, but high costs, limited availability, and sustainability challenges pose challenges to its implementation. Pragmatic's flexible FlexICs sustainably bridge the physical and digital worlds, enabling low-energy, low-cost, large-scale edge and item-level intelligence in industries such as healthcare, logistics, consumer packaged goods, and electronics. He also introduced the Pragmatic NFC Connect, a product in the FlexIC product line that redefines the parameters for near-field communication (NFC) connectivity, providing seamless intelligent solutions for mass-market products and unleashing the potential of a truly connected world.

How to overcome the bottlenecks of traditional RFID, such as slow write speeds, short lifespan, and high power consumption? RAMXEED utilizes a passive RFID solution with built-in FeRAM, which increases write speeds by hundreds to thousands of times, achieves a write cycle endurance of up to 1 trillion times, offers extremely high energy efficiency, and can even operate without batteries. This presents significant advantages in scenarios such as smart manufacturing, medical traceability, and wireless sensing. In the AI era, FeRAM RFID enables real-time, high-frequency data collection and storage in edge devices, injecting new momentum into intelligent IoT architectures.

Re-PIoT technology, derived from the reverse evolution of the EP-IoT technology jointly developed with Huawei, is a revolutionary achievement in the field of passive IoT inventory positioning. Its positioning accuracy is outstanding, with horizontal errors of < 1.5 meters in most cases and vertical accuracy reaching 0.5 meters (capable of accurate positioning down to the level of cabinets), breaking through the limitations of traditional positioning. The core device, the Helper, consumes only 1/1000th the power of traditional readers and costs 1/10th the cost. It also boasts 100 times higher sensitivity and a battery life of over three years. In practical applications, it can enable contactless inventory in smart Stores. When combined with robots in smart warehouses, inventory positioning efficiency reaches 300 times that of a traditional five-person team. In the future, it is expected to expand into more scenarios by integrating robots and video, revolutionizing RFID positioning standards.

Anisotropic conductive adhesive, a key micro-interconnect material, is playing a vital role in RFID packaging due to its unique properties of Z-axis conductivity and in-plane insulation. Core Spring Semiconductor boasts strong packaging material R&D capabilities. Through forward Engineering, it has developed a variety of ACP products featuring high glass transition temperatures (Tg), excellent chip encapsulation, and millisecond-speed curing to meet the technical requirements of customers' RFID Inlays with varying chips, substrates, bonding equipment, and curing temperatures. Core Spring Semiconductor will continue to provide RFID customers with other cost-effective key materials and looks forward to expanding the application of ACP materials into other fields.