Product name: COB chip
Specifications: 2.5*4mm/308 pieces, 3.5*5.5mm/165 pieces, 5*8mm/96 pieces, can be customized
Thickness: 0.30~0.6mm (optional)
Product chips: FM11RF08, TK4100, EM series, NXP series, Infineon series, Atmel series, Siemens series, TI series, ST series, etc.
Material: PCB material
Erasable and writable times: 100,000 times
Frequency: Low frequency: 125Khz High frequency: 13.56MHz Ultra high frequency: 860-960Mhz
Scope of application: Smart card manufacturers can use it directly
Note: 308 spells/165 spells/96 spells
Compact design
COB technology can package the chip directly on the PCB, thereby reducing the overall size and making the product more compact.
High integration
COB technology can realize the integration of multiple functional modules, improve the integration level of the circuit, and help simplify the product structure.
Cost-effectiveness
COB technology can reduce some steps in the traditional packaging process and help cost control
heat radiation
The chip is in direct contact with the PCB and has good heat dissipation performance, which is conducive to long-term stable operation.
Application:
COB chips are widely used in LED lamps, automotive electronics, medical equipment, consumer electronics and other fields, providing more efficient, compact and reliable solutions for various electronic products.
Contact: Adam
Phone: +86 18205991243
E-mail: sale1@rfid-life.com
Add: No.987,Innovation Park,Huli District,Xiamen,China
Adam